Blending Compatibility Simulation of UV-thermal Curing Solution with Epoxy Resin
نویسندگان
چکیده
Abstract To make a UV-thermal curing solution based on bisphenol A, epoxy acrylate (EA) and resin of diglycidyl ether A (DGEBA) were uniformly mixed. The Blends module in the Materials Studio software was used to carry out molecular dynamics simulation blending compatibility evaluate rationality achieve through interaction parameters, binding energy, phase diagram. energy distribution DGEBA EA is not consistent at 298 K, parameter 6.4335. When temperature rises 365 diminishes 3.5795. UV thermal improved by changing molar ratio 0.45 raising 340 K. results can be guide predict process properties resin.
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ژورنال
عنوان ژورنال: Journal of physics
سال: 2023
ISSN: ['0022-3700', '1747-3721', '0368-3508', '1747-3713']
DOI: https://doi.org/10.1088/1742-6596/2553/1/012016